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Texas Instruments Delivers First Single-Chip, Dual-Band WCDMA RF Transceiver with Industry's Lowest Power

Unmatched Integration, Power Efficiency and Flexibility Reduce 3G Wireless System Size and Cost

3GSM WORLD CONGRESS, Feb. 24 /PRNewswire/ -- Texas Instruments Incorporated (TI) announced today a new means of driving down the cost and complexity of WCDMA handset design with the sampling of the industry's first single-chip, dual-band WCDMA RF transceiver for advanced 3G mobile devices. By combining TI's production-proven WCDMA transmit and receive devices into an advanced single-chip RF solution, wireless manufacturers gain a low bill of materials (BOM), improved design and power efficiency through a smaller footprint and sleeker form factors.

"The TRF6302's highly integrated design and low power consumption significantly reduces the complexity and streamlines the development of advanced 3G handsets," said Christophe Jouin, general manager of TI's 3G wireless chipset business. "By supporting both the 800 MHz and 2100 MHz operations in a single RF chip, the TRF6302 is especially attractive to manufacturers eager to reuse their handset platforms across multiple geographic markets and many have selected it for future 3G handset development."

Single-Chip Device Combines Proven Functionality

The TRF6302 combines functions of TI's proven TRF4150 single-chip WCDMA transmitter and TRF5150 single-chip WCDMA receiver, which are already in production and shipping in handsets today. The TRF6302 consumes less than 30mA of current for receive (RX) and less than 60mA for transmit (TX) while supporting a 6dBm output power level. This combination offers a 20 percent power reduction over existing RF solutions and is the industry's lowest for such a device.

The TRF6302 supports both 800 MHz and 2100 MHz band operations and offers reduced complexity and requires fewer external filters over devices based on intermediate frequency (IF) techniques. The device features TI's advanced direct conversion (DC) technology that provides unparalleled integration of numerous functions, including voltage control oscillators (VCOs), low-noise amplifiers (LNAs), phase lock loops (PLLs), loop filters, synthesizers and low dropout regulators (LDOs).

Taking UMTS to New Heights

The TRF6302 is a key component of TI's advanced and highly integrated TCS4105 four-chip UMTS solution for handsets, smartphones, wireless PDAs, PC cards and other devices. Currently sampling in conjunction with TI's OMAP(TM) application processors, the TCS4105 chipset delivers extended standby time over existing 3G handsets without sacrificing high performance applications processing. Its high level of integration reduces parts count over competing UMTS chipset solutions. The TRF6302 contributes to this achievement through its efficient RF design, subsequently lowering the cost and power consumption of the entire solution.

Along with the TRF6302 dual-band WCDMA RF transceiver, other components of the TCS4105 chipset include the TBB4105 UMTS digital baseband, the TWL3024 analog baseband and power management device, and the TRF6151 quad-band GSM/GPRS single-chip transceiver which is already in high-volume production. The TCS4105 chipset can be coupled with a TI OMAP applications processor to support rich 3G multimedia applications such as imaging and video, video conferencing, interactive 3D gaming, location-based services and others.

Availability

Samples of the TRF6302 are available today with full production planned for the second quarter of 2004.

TI - Making Wireless

TI is the leading manufacturer of wireless semiconductors, delivering the heart of today's wireless technology and building solutions for tomorrow. TI provides a breadth of silicon and software and 15 years of wireless systems expertise that spans handsets and base stations for all communications standards, wireless LAN, Bluetooth and Ultra Wideband. From custom to turn- key solutions, including complete chipsets and reference designs, OMAP application processors, core digital signal processor and analog technologies built on advanced semiconductor processes, TI is making wireless personal, intelligent and seamless.

About Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.

Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at http://www.ti.com/ .

Trademarks

All registered trademarks and other trademarks belong to their respective owners.

CONTACT: Patty Arellano of Texas Instruments Incorporated,
+1-214-480-4665, or parellano@ti.com ; or Kristina Arnold, +1-972-308-9113, or
karnold@golinharris.com , for Texas Instruments Incorporated. Please do not
publish these e-mail addresses or numbers.

Web site: http://www.ti.com/
http://www.3gsmworldcongress.com/congress

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